- All sections
- G - Physics
- G03F - Photomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices; materials therefor; originals therefor; apparatus specially adapted therefor
- G03F 1/70 - Adapting basic layout or design of masks to lithographic process requirements, e.g. second iteration correction of mask patterns for imaging
Patent holdings for IPC class G03F 1/70
Total number of patents in this class: 631
10-year publication summary
|
38
|
59
|
46
|
58
|
48
|
64
|
82
|
69
|
88
|
11
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
157 |
| ASML Netherlands B.V. | 6816 |
79 |
| Samsung Electronics Co., Ltd. | 131630 |
43 |
| Synopsys, Inc. | 2829 |
39 |
| D2s, Inc. | 150 |
19 |
| United Microelectronics Corp. | 3921 |
16 |
| Carl Zeiss SMT GmbH | 2646 |
14 |
| Kioxia Corporation | 9847 |
14 |
| International Business Machines Corporation | 60644 |
13 |
| Canon Inc. | 36841 |
10 |
| Nikon Corporation | 7162 |
9 |
| KLA Corporation | 1223 |
9 |
| Applied Materials, Inc. | 16587 |
8 |
| Siemens Industry Software Inc. | 1633 |
8 |
| Intel Corporation | 45621 |
6 |
| Tokyo Electron Limited | 11599 |
6 |
| Lam Research Corporation | 4775 |
6 |
| GLOBALFOUNDRIES U.S. Inc. | 6459 |
6 |
| KLA-Tencor Corporation | 2574 |
6 |
| Changxin Memory Technologies, Inc. | 4732 |
6 |
| Other owners | 157 |